Riepe LP289/99® Antistatic Coolant

Used to help reduce static charge, lower chip adhesion, cool the bonding line in a controlled way and support tool life.

Antistatic coolant applied to the bonding line after the edge band has been bonded. Used to help reduce static charge, lower chip adhesion, cool the bonding line in a controlled way and support tool life.

Machine type, edge band, adhesive technology, line speed, application point and finish expectation should be assessed together. The final selection should be confirmed with current technical documentation and an application trial.

You can use the Turkish TDS and original SDS links on this product page. Check the current document version before application.